Basic Information

Part number: 810-17059-1

Brand: Lam Research (Panlin Semiconductor)

Board type: Edge sensor signal conversion and conditioning board (Junction PCB)

Compatible devices: 2300 Kiyo, 2300 Flex 300mm plasma etching machine

At the system link position: robotic arm optical edge sensor → this board → ribbon cable output to 810-099175-011 (VIOP-III VME board) analog multi-channel input channel; Only signal conditioning and distribution, no processor chip, no firmware running, and no participation in VME/Lonworks bus.

Hardware Specifications

signal interface

Multi channel infrared penetrating wafer edge sensor input, receiving weak analog optoelectronic signals

Onboard RC filtering network and signal buffering circuit to suppress electromagnetic interference noise in robotic arm motion

Multi channel signal summary output, sent to the VIOP-III board analog acquisition port through flat ribbon cable

No signal computing capability, only used for signal buffering, filtering, distribution, and protection.

power supply

External 24VDC cabinet power supply, not powered from VME backplane

The board is equipped with fuses, reverse polarity protection, and surge absorption devices to prevent sensor side surges from penetrating the analog input of the rear VIOP board.

Connectors and indicator lights

Multiple sets of Molex rectangular connectors: sensor input, output ribbon, power interface

Only 1 power LED, no communication or bus status lights.

Environment and Physics

Working temperature: 10 ℃ -50 ℃ (inside the semiconductor equipment cabinet)

Storage temperature: -20 ℃~+70 ℃

FR‑4 PCB， Screw locking and fixation; Origin in the United States.

Device Function

Edge detection signal preprocessing: Collect multiple sets of photoelectric sensor signals from the robotic gripper, filter out electrical noise caused by motion, and provide edge position sampling to VIOP-III.

Wafer status judgment assistance: assists in determining whether the claw holds the wafer, wafer offset, fragments, or missing pieces.

Pre alignment of robotic arm: Edge position data is used for pre alignment calculation of robotic arm to avoid the risk of chip collision.

Isolation protection: Isolate the surge at the sensor end to protect the back-end VIOP-III analog input channel from damage.

Typical fault phenomena

Robot arm falsely reports no wafer, actual gripper holds wafer

Frequent reporting of wafer edge offset alarm, triggering of chip transfer interlock

The edge detection signal has high noise and randomly reports lost chips

VIOP-III reads edge analog signals that are all 0 or at full range

Will not report faults in VME bus, Clock Arb, LonWorks nodes; All faults are concentrated in the mechanical arm transfer process.