LAM 810-802969-002 | NODE 1 PM COMMON / Node1 Mainboard

Core functionality

This is the main node motherboard (Node1) of the VTM system, which belongs to the highest level local I/O node board of the 2300 machine and has a higher status than the ordinary Type3 node board (810-800256-004):

As the main node in the VTM cabinet, coordinate and manage other sub node boards (such as 810-800256-004)

DI/DO for collecting chambers, transmission, water cooling, gas cabinets, safety interlocks, analog signals

Integrate Ethernet communication, communicate with the upper host of the machine, issue process instructions, upload machine status and alarm information

Integrate multiple DB37/DB25/DB9 peripheral interfaces to directly connect motors, sensors, pressure modules, and safety circuits

Local hardware security interlock: When the leakage board (810-800156-202) sends out a leakage alarm signal, it is aggregated by the sub node board and sent to this board, triggering an emergency stop of the machine

Electrical core parameters

Power supply: DC+24V machine DC power supply, on-board stabilized power supply, generating 5V/3.3V inside the board

Main control: onboard embedded MCU+Flash firmware, firmware bound to machine configuration, replacement of spare parts must burn corresponding machine firmware

signal interface

Multi channel DB37, DB25, DB9 D-Sub interface: digital DI/DO, analog 0-10V/4-20mA

2 RJ45 Ethernet ports: used for Ethernet communication in VTM systems

Multiple sets of Molex power/signal sockets, external sensors, solenoid valves, safety circuits

Large European style backplane connector: VTM backplane bus, connected to other sub node boards

Isolation and Protection: Optocoupler isolates digital channels; Simulate channel TVS surge suppression; Onboard replaceable fuses; ESD protection, suitable for Fab plasma RF high EMI environment

PCB: Multi layer FR4, conformal coating, three proof coating, dedicated for clean workshops, resistant to corrosion caused by water vapor, dust, and plasma by-products

Physical and environmental parameters

Weight: Approximately 0.25kg

Appearance: Rectangular VTM card insertion motherboard, front dense D-Sub+Ethernet port+terminal, back European style backplane gold finger connector

Working temperature: 10~40 ℃ (wafer Fab cleanroom)

Storage temperature: -20~+70 ℃

Humidity: 5% -80% without condensation, condensation can cause false triggering of safety circuits

Our products are widely used in CNC mechanical metallurgy, petroleum and natural gas, and petrochemical industries,
Chemical industry, paper and printing, textile printing and dyeing, machinery, electronic manufacturing, automobile manufacturing,
Plastic machinery, electricity, water conservancy, water treatment/environmental protection, municipal engineering, boiler heating, energy, power transmission and distribution.
The quoted price is not the actual price. Please contact the shopkeeper before placing the order to confirm the price and delivery time!!!

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